DIP（Dual-In-line packages） have been an industry standard for a long time. The applications are common in consumer products, automotive devices, memory, analog ICs, and microcontrollers. These packages have evolved into a state-of-the-art technology owing to their robust reliability and great improvement on performance. Using TH ( through hole) and assembly, DIP provide an assortment of packaging capabilities, especially in low pin count devices at competitive manufacturing costs.
* The width of DIP is the distance of shoulder-to-shoulder.
Reliability Test Standards
The test criterion is zero defect out of 77 sampling units.
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